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Sealtech catalogue

PRODUCT INFO

MEMS SENSOR PACKAGES

  • Sensor Packages

  • TO-3, TO-5, TO-8, TO-39, TO-46,  etc.  Stem & Headers
  • Micro-electronic Packages
  • Opto-electronic Packages
 

Product functions and technical characteristics

SEALTECH's sensor packaging products are manufactured with GTMS (Glass to Metal Seal) and C/GTMS (Ceramic/Glass To Metal Seal) technologies. GTMS packaging enables reliable transmission of data or signals from MEMS (Micro Electro Mechanical Systems) devices. Its primary role is to carry/transmit electrical/electronic or optical signals, or to flow current and protect MEMS devices at the same time. SEALTECH's GTMS and C/GTMS packages use general steel materials or special materials such as Kovar and nickel alloy, and use a material with very strong corrosion resistance for glass. Glass and metal airtight sealing technology, ceramic metallizing technology, and brazing technology are used to secure the airtightness of packaging parts.

Product Advantages

The MEMS sensor is affected physically and chemically in addition to changes in temperature and humidity depending on the using environment. SEALTECH's GMS (Glass to Metal Seal) and C/GTMS (Ceramic / Glass to Metal Seal) products reliably protect sensor devices from temperature changes, humidity, vibration, and physical and chemical influences in harsh environments and transmit electrical and optical signals without loss.

General Specifications

SEALTECH provides customized solutions for hermetic sealing products. We produce and provide GTMS products that meet customer needs from the product design stage. Please refer to the technical information for the general specifications of the product.

Application

  • MEMS Sensor
  • Pressure  Sensor, Temperature Sensor, Humidity Sensor, Gas Sensor, UV Sensor, Gyro Sensor etc.
  • Housings for photodiode/ Transistor, LADAR, Laser and IR Sensor, LED, LD, Diode housings
  • High vacuum Packages, Sensor for Medical equipment etc.
  • Housings for Optical Sensor Packages
  • Packaging/housing of semiconductor electronic circuit boards

Related Keywords

  • MEMS Sensor, Hermetic seal , GTM sealing, Optical package
  • Sensor package , Micro-electronic Packages, Opto-electronic Packages
  • High vacuum Packages, Ceramic Metalizing & Brazing
  • Military, Aerospace Packaging & housing

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