Hermetically sealed packages
- Integrated Micro-electronic Packages
- Semiconductor Electronic Packages
- TO(Transistor Outline) Packages
- RF Packages
Product functions and technical characteristics
SEALTECH's hermetic sealing housing and packaging products are manufactured with GTMS (Glass to Metal Seal) and C/GTMS (Ceramic/Glass to Metal Seal) technologies. Hermetically sealed packaging of glass and metal, ceramic and metal enables reliable transmission of signals or data from electronic circuits and optical devices in electronics/communications. Its basic role is to transmit/transmit electrical signals, flow currents and at the same time safely protect MEMS devices and electronic communication components. SEALTECH's GTMS and C/GTMS packaging products use general steel materials or special materials such as Kovar and nickel alloy. Glass used for packaging and housing is electronic glass and is a highly corrosion-resistant material. Glass and metal airtight sealing technology, ceramic metallizing technology, and brazing technology are used to secure the airtightness of packaging parts.
The optical communication/sensor module is affected physically and chemically in addition to changes in temperature and humidity depending on the using environment. SEALTECH's GTMS (Glass to Metal Seal) and C/GTMS (Ceramic/Glass to Metal Seal) products reliably protect devices from extreme temperature changes, humidity, vibration, and physical and chemical influences, and send/transmit electrical and optical signals without loss.
SEALTECH provides customized solutions for hermetic sealing products. We produce and provide GTMS products that meet customer needs from the product design stage. Please refer to the technical information for the general specifications of the product.
- Housings for Optical TX,RX Module Packages
- Housings for Optical Sensor Packages
- Housings for photodiode/ Transistor, LADAR, Laser and IR Sensor, LED, LD, Diode housings,
- Packaging/housing of semiconductor electronic circuit boards
- Hermetically sealed packages , TO(Transistor Outline) Headers , Integrated Packages
- Hybrid Microelectronic packages , Micro-electronic packages
- Military, Aerospace Packaging & housing
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