Hermetically sealed Packaging & Housing
- TO-3, TO-5, TO-8, TO-39, TO-46 Stem & Headers
- Micro-electronic Packages
- Optical Module/Sensor Packages
- TO(Transistor Outline) Packages
- Hermetically Sealed High Vacuum Connectors
- Hermetically Sealed RF Connectors(50ohm matched)
- Hermetically Sealed Micro-D Connectors
- Hermetically Sealed Miniature Connectors
- Hermetically Sealed High Vacuum Feedthru
- Hermetically Sealed Power Feedthru
- Li Battery Header
Product functions and technical characteristics
SEALTECH's hermetic sealing housing and packaging products are manufactured with GTMS (Glass to Metal Seal) and C/GTMS (Ceramic/Glass to Metal Seal) technologies. Hermetically sealed packaging and feedthroughs of glass and metal and ceramic and metal enable reliable data transmission and signal transmission of electronic/communication devices. Its primary role is to maintain airtightness inside the electronic package and to send/transmit electrical or optical signals, flow current and protect the device at the same time. SEALTECH's GTMS and C/GTMS products use general steel materials, stainless steel or special materials such as Kovar and nickel alloy. Glass used for packaging and housing is electronic glass and is a highly corrosion-resistant material. Glass and metal airtight sealing technology, ceramic metallizing technology, and brazing technology are used to secure the airtightness of packaging parts.
The optical communication/sensor module is affected physically and chemically in addition to changes in temperature and humidity depending on the using environment. SEALTECH's GTMS (Glass to Metal Seal) and C/GTMS (Ceramic/Glass to Metal Seal) products reliably protect devices from extreme temperature fluctuations, humidity, vibration, and physical and chemical influences, and transmit electrical and optical signals without loss.
SEALTECH provides customized solutions for hermetic sealing products. We produce and provide GTMS products that meet customer needs from the product design stage. For general specifications of the product, please refer to the technical information.
- Packages for MEMS Sensor (Pressure Sensor, Temperature Sensor, Humidity Sensor, Gas Sensor, UV Sensor, Gyro Sensor etc.)
- Housings for photodiode/ Transistor, LADAR, Laser and IR Sensor, LED, LD, Diode housings
- Sensor for Medical equipment etc.
- Hermetically sealed packages , TO(Transistor Outline) Headers , Integrated Packages
- Hybrid Microelectronic packages , Micro-electronic packages
- Glass to metal sealing, Ceramic Metalizing & Brazing, Hermetic seal , GTM seal
- MEMS Sensor package, Optical Module package
- High Vacuum Feed through, High vacuum connector
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